Bhubaneswar: India marked a major milestone in its semiconductor journey on Sunday as the foundation stone for the country’s first advanced 3D glass substrate packaging facility was laid in Odisha.
Chief Minister Mohan Charan Majhi attended the groundbreaking ceremony along with Union Minister for Electronics and Information Technology Ashwini Vaishnaw. The project is expected to position Odisha at the forefront of global electronics manufacturing and artificial intelligence.
The facility involves an investment of Rs 1,943 crore and is expected to generate more than 2,500 direct and indirect employment opportunities, Majhi said in a series of posts on X. Officials said the project will also support the development of testing laboratories and ancillary industries, strengthening the state’s industrial ecosystem.
The initiative aims to accelerate Odisha’s transition from a mineral-driven economy to a knowledge-driven economy by leveraging skilled human resources and modern infrastructure.
The chief minister said the project reflects the state’s commitment to attracting high-technology investments and creating quality employment opportunities for youth. He added that Odisha is emerging as a preferred destination for advanced electronics manufacturing due to its availability of power, skilled workforce, and supportive governance.
The project is being developed with support from the Union government and aligns with broader national efforts to strengthen domestic capabilities in semiconductor and electronics manufacturing.
Officials said the initiative is expected to contribute to the vision of building a self-reliant India and support the growth of next-generation industries in the country.
Meanwhile, Majhi held a courtesy meeting with Vaishnaw and discussed various development works.
